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| 工艺介绍及流片计划（下面列出合作伙伴的logo,包括和舰，华虹NEC以及上海××公司） |
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Foundry |
Process |
Technology |
HJTC |
0.18um |
Std. Logic |
1.8/3.3V |
LL |
MixedMode |
RFCMOS(20K) |
HHNEC |
0.35um |
CZ6H |
Standard Logic |
5V |
Mixed Signal |
OTP |
EEPROM |
UC1H |
Standard Logic |
3.3V |
Mixed Signal |
HV(option) |
3.3/14V Or 3.3/18V |
0.25um |
CL250G |
Standard Logic |
2.5/3.3V |
CM250G |
Mixed Signal |
EF250G |
eFlash |
2.5/5V |
CA25 |
Mixed Signal |
3.3V |
CR25 |
RF CMOS |
0.18um |
CL180G |
Standard Logic |
1.8/3.3V |
CM180G |
Mixed Signal |
CA18 |
Mixed Signal |
CR18 |
RF CMOS |
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| HJTC 2007 MPW计划 |
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| 合作伙伴 |
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